Show simple item record

dc.contributor.authorRanvier, S.
dc.contributor.authorPaquay, S.
dc.contributor.authorRequier, S.
dc.contributor.authorLamy, H.
dc.contributor.authorRochus, V.
dc.contributor.authorFrancis, L.A.
dc.contributor.authorRochus, P.
dc.date2011
dc.date.accessioned2016-03-29T12:43:53Z
dc.date.available2016-03-29T12:43:53Z
dc.identifier.isbn9781457701078
dc.identifier.urihttps://orfeo.belnet.be/handle/internal/3119
dc.descriptionIn this paper, several physical phenomena that are usually not taken into account in MEMS simulations are considered for the simulation of a MEMS xylophone bar magnetometer. These phenomena are the temperature dependency of the material properties, the strong coupling between various fields of physics (thermal, electric and mechanical) and the stress produced by the change of temperature inside the structure. It is shown that the temperature dependency of the material properties has a relatively small influence whereas the pre-stress has a significant one. Because of the pre-stressed state, the deformation of the bar at the fundamental frequency is not a typical first mode vibration but it exhibits additional waves between the linkages, where the bar is stressed, which significantly decrease the amplitude of the deflection.
dc.languageeng
dc.titleInfluence of multiphysics couplings on the performance of a MEMS magnetometer
dc.typeConference
dc.subject.frascatiPhysical sciences
dc.audienceScientific
dc.subject.freeFundamental frequencies
dc.subject.freeMaterial property
dc.subject.freeMEMS simulations
dc.subject.freeMultiphysics coupling
dc.subject.freePhysical phenomena
dc.subject.freePre-stress
dc.subject.freePre-stressed
dc.subject.freeStrong coupling
dc.subject.freeTemperature dependencies
dc.subject.freeElectric properties
dc.subject.freeExperiments
dc.subject.freeMagnetometers
dc.subject.freeMaterials properties
dc.subject.freeMechanical properties
dc.subject.freeMicroelectronics
dc.subject.freeMicrosystems
dc.subject.freeStresses
dc.source.title2011 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
dc.source.page5765803
Orfeo.peerreviewedNo
dc.identifier.doi10.1109/ESIME.2011.5765803
dc.identifier.scopus2-s2.0-79957898421


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record